Brass & Copper Etchants / Acid Salts

Metalline Corporation manufactures several products for activating or mildly etching brass and copper alloys prior to plating. Listed below is a brief description of our three best selling products.

• CU-ACT is a powdered acid salt formulated to remove brazing scales and flux from brass and copper alloys. CU-ACT will also activate brass, copper alloys and acid copper plated surfaces prior to nickel plating.
• CB ETCH is a powdered acid salt formulation that activates brass and copper alloys prior to nickel plating. CB ETCH does not contain any fluoride or chloride based components.
• VORTECID^® GP is a powdered acid salt readily soluble in water.  VORETCID^® GP contains sulfate and fluoride components and replaces muriatic or sulfuric acids for acid activation prior to plating. This product may also be added to muriatic or sulfuric acid to improve smut removal.